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- Feb 28Wholesale Stocked 10ml Square Coating White Black Perfume Glass Bottle Customized Gift
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- Feb 2830kg Industrial Washer Extractor Ideal for Healthcare Facilities
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Product List
4786. Advanced High-Speed LED Die Bonder for Semiconductor Manufacturing 
[Feb 28, 2026]
Discover the revolutionary Dual Head Dispensing High-Speed LED Clip Wafer Die Bonder, a pinnacle of precision and efficiency from Jiangsu Himalaya Semiconductor Co., Ltd. Embrace advanced semiconductor bonding with this ...
4787. Advanced High-Speed Die Attach System for Qfn and Dfn Packaging Solutions [Feb 28, 2026]
Product Description This high-speed automated assembly and testing system is a cutting-edge solution for manufacturers seeking ultra-efficient, reliable, and scalable production. Its advanced motion control, parallel ...
4788. Advanced Precision Wire Bonder for High-Power Device Packaging [Feb 28, 2026]
Product Description Our advanced automated wire bonder is engineered for high-speed, high-reliability interconnections in semiconductor packaging. It features a robust long-gantry motion system with a spacious 300mm x ...
4789. Advanced Front End Ion Implanter for Precision Semiconductor Manufacturing Solutions [Feb 28, 2026]
Product Description 1. Product overview Ion implanter is one of the high pressure small accelerators with the largest number of applications. It is the ion source to obtain the required ions, after the acceleration ...
4790. Innovation Technologies Vacuum Ion Implantation System [Feb 28, 2026]
Innovation Technologies Vacuum Ion Implantation System Product Description 1. Product overview Ion implanter is one of the high pressure small accelerators with the largest number of applications. It is the ion ...
4791. Affordable High-Precision Laser Marking Machine for Versatile Materials [Feb 28, 2026]
Product Description Using a pulsed fiber laser, paired with a self-developed intelligent control system, the laser pulse frequency and pulse width are independently adjustable. Red light assistance is available for ...
4792. Precision Die Bonding Machine for High-Quality Soldering Solutions [Feb 28, 2026]
High Quality Fully Automatic Soft Solder Die Bonding Machine Factory Product Description This equipment is a soft solder die bonder designed for thermal die bonding of TO power devices. This equipment is a new ...
4793. Automatic Semiconductor Soft Solder Bonding Die Attach Solution SD800 Die Bonder [Feb 28, 2026]
Fully Automatic Die Bonding Machine System manufacturer Product Description Revolutionize Your Production with the SD800 Fully Automatic Die Bonding Machine In the fast-paced world of semiconductor manufacturing, ...
4794. Precision Automatic Eutectic Flip Chip Die Bonding Machine for IC Packaging [Feb 28, 2026]
Die Bonder Chip Bonding Equipment (Die Bonder) Also known as a die bonder, it is a semiconductor packaging device used to mount and attach chips onto substrate packages. It employs various methods such as using nozzles ...
4795. High-Speed Automatic Die Attach Equipment for Precision Bonding [Feb 28, 2026]
Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
4796. Automatic LED/IC Flip Chip Die Bonding Machine [Feb 28, 2026]
HMLA-S platform is an off-line automatic micro assembly system developed by the company, which can be equipped with nozzle heating module, material tray/wafer placing plate, ultrasonic module, laser heating module, UV ...
4797. High Quality Ion Implanter Semiconductor Material Small Implanter [Feb 28, 2026]
Product Description 1. Product overview Ion implanter is one of the high pressure small accelerators with the largest number of applications. It is the ion source to obtain the required ions, after the ...
4798. High Efficiency Automatic PCB and PCBA Manufacturing Machine [Feb 28, 2026]
Product Description PCB/PCBA Online Cutting Machine is used for the cutting and separating of small and multi-connected PCBs, such as those used in mobile phones, digital cameras, GPS devices, PDAs, 5G ...
4799. Wire Bonding Machine for Semiconductor Production [Feb 28, 2026]
Product Description Maximize Output, Minimize Downtime: The H580PLUS Automatic Wire Bonder The Himalaya H580PLUS is a high-performance, fully automatic, vertical injection molding machine designed for mass production. ...
4800. High-Performance LED Low Bay Light with Adjustable Brightness [Feb 27, 2026]
Parameters Model HT03-120W HT03-150W HT03-175W HT03-200W HT03-250W Power 120W 150W 175W 200W 250W Input Voltage AC90-300V AC90-300V AC90-300V AC90-300V AC90-300V LED Type 3030/5050 3030/5050 3030/5050 3030/5050 ...
Company: Changzhou DNA International Co., Ltd
