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Product List
14911. Purity Customize Flame Polishing Clear Fused Silica Quartz Glass Flange for Semiconductor 
[Dec 19, 2025]
Customize flame polishing Clear Fused Silica Quartz Glass Flange : Clear silica quartz glass flange is widely used in electric light source, electrical appliances , semiconductor, Solar, optical communications, ...
14912. Purity Customize Circular Froty Fused Silica Wafer Quartz Glass Plate for Semiconductor [Dec 19, 2025]
Customize Circular Frosty Fused Silica wafer Quartz glass plate for semiconductor: Coating of frosty qiartz quartz plate : high anti-UV film, antireflective film, gold, aluminum, silver series quartz glass and quartz ...
14913. Small Size Purity Customize Frosty Fused Silica Quartz Glass Rod for Semiconductor [Dec 19, 2025]
Small Size Customize Frosty Fused Silica Quartz Glass Rod for semiconductor: The frosty quartz glass rod ends is cut squiare and it also can be polish. Thie frosty fused quartz rod is mainly used as semiconductor ...
14914. Clear Drilled Laser Perforated Semiconductor Square Quartz Glass Plate [Dec 19, 2025]
Product Description 1.Customized optical JGS1 JGS2 Clear Drilled Laser Perforated Semiconductor Square Quartz Glass Plate 2.Quartz plate/round quartz disc/quartz sight glass discperating temperature is ...
14915. Both Sides Grind Customize Frosty Fused Silica Quartz Glass Flange for Semiconductor [Dec 19, 2025]
Both sides grind Customize Frosty Fused Silica Quartz Glass Flange for semiconductor Processing technology of frosty quartz glass flange: both sides grind, one side grind The purity of frosty silica quartz flange is ...
14916. Advanced Cleanroom Ovens for Electronics and Semiconductor Use [Dec 16, 2025]
Product Description Other Specification Heating mode 26kw 780L × 1 branch Model structure Single door design, the control box is located above the machine Insulation material The use of insulation ...
Company: Kunshan Fanqi Machinery Co., LTD
14917. Advanced Fully Automatic Vertical Vacuum Oven for Semiconductor Drying [Dec 13, 2025]
Product Description Product Usage: It is used in semiconductor and pan-semiconductor processes such as low-temperature baking, drying, water removal, curing, and debinding in a vacuum environment. Features: 1. ...
14918. Advanced Semiconductor Packaging Die Attach Bonder for Precision Assembly [Dec 13, 2025]
Product Description Clip Bonder High-speed Clip Bonding System placement accuracy: ±50µm @3σ, theta placement accuracy: ±3°@3σ; Up to 20Clips / Cycle; Prebond & Posbond ...
14919. Djj-120 Automatic Chamfering Machine for Semiconductor Wafer [Dec 13, 2025]
Product Description Introduction to the MET-5600 Fully Automatic Wafer Chamfering Machine In the rapidly evolving semiconductor industry, precision and efficiency in wafer processing are critical to maintaining high ...
14920. Advanced Fully Automatic Laser Peeling Machine for Semiconductor Applications [Dec 13, 2025]
High End Semiconductor Fully Automatic Llo Laser Peeling Machine Product Description High-End Semiconductor Fully Automatic LLO Laser Lift-Off Machine Product Overview This system is a fully automated laser lift-off ...
14921. Semiconductor High End Wafer Bonder High-Precision Die Bonding Machine Made in China [Dec 13, 2025]
Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ±0.04mm Bonding speed (UPH) 20K(Chip size 0.3mmX0.3mm,SOT23-13R frame) Chip ...
14922. Laser Slicing Machine for Sic Ingot Third-Generation Semiconductor Sic Ingot Laser Slicing [Dec 13, 2025]
Product Description Equipment features: 1. High dynamic and high-power femtosecond laser 2. High precision optical scanning processing system 3. High flexibility and high efficiency stripping system 4. Smooth ...
14923. China Factory Chip Testing and Detection Wafer Bonder Semiconductor Sorting Equipment [Dec 13, 2025]
Product Description Equipment Specifications PIaK PLACE HANDLER SHF9000 Test station 1/2/4/8 site Nozzle module 1×4 mode Test mode Room temperature Material handling cart Supports 1X2,1X4,2x2,2x4 Index time <400ms UPH ...
14924. Low Oxygen (<1000 ppm) Titanium Bar Gr2, for Sputteringtargets in Semiconductor Manufacturing [Dec 09, 2025]
Product Description Titanium bars Product Description: Titanium Rods / Titanium Bars Material: Pure Titanium,Titanium Alloy Standard: GB/T 2965-2007, GB/T13810-2007, ASTM B348/ASME SB348, ASTMF67, ASTM F136, ...
Company: Wuxi Yh Internation Co., Ltd.
14925. Wit-1fully Automatic Intelligent Sample Preparation System for PCB Semiconductor [Nov 26, 2025]
Model WIT-1 Input Electricity 220VAC,20A Compressed air Pressure> 0.6MPa External water connection Water pressure< 0.3MPa Sample Mounting Box Square shape Three different specifications are ...
